There are many standards in the circuit board industry, and the commonly used printed circuit board standards are as follows:

1) IPC-ESD-2020: A joint standard for the development of electrostatic discharge control procedures. Covers the necessary design, setup, successful implementation and protection of ESD containment procedures. Based on the historical experience of some military groups and economic activity groups, provide guidance for electrostatic discharge sensitive treatment and best care for a period of time.

2) IPC-SA-61A: Manual for semi-aqueous cleaning after welding. Covers various aspects of semi-aqueous cleaning, covering chemical, production carryover, facility, process, process control, and background and safety considerations.

3) IPC-AC-62A: Aqueous cleaning manual after welding. Describe the production of residues, types and properties of water-based cleaning agents, water-based cleaning processes, facilities and processes, quality control, background control and employee safety, and the cost of calibration and calibration of cleanliness.

4) IPC-DRM-40E: Through-hole soldering evaluation table reference manual. Detailed description of components, hole walls, and welding surface coverings as required by the standard, in addition to computer-generated 3D graphics. Including tin filling, contact whiskers, tin dipping, vertical replenishment, solder pad cover, and a large number of missing solder joints.

5) IPC-TA-722: Evaluation Manual for Welding Technology. Covering 45 articles on various aspects of welding technology, the internal significance involves ordinary welding, welding materials, manual welding, batch welding, wave welding, reflow welding, gas phase welding and infrared welding .

6) IPC-7525: Model Board Preset Guide. Presets and fabrication of pattern boards for solder paste and surface mount adhesives provide guide orientation objectives. Pattern board prefabs using surface mount technology are also discussed, and components with through-hole or flip-chip are introduced. Part's ?Kunhe technology, covering overlay, duplex and staged pattern board presets.

7) IPC/EIAJ-STD-004: Specifications for fluxing fluxes are required to cover Appendix I. It contains technical indicators and classifications of turpentine, natural resin, etc., organic and inorganic fluxes classified according to the content and activation degree of halides in the flux; it also covers the use of flux, including flux and free flux. Low carryover flux used in cleaning processes.

8) IPC/EIAJ-STD-005: Specifications for solder pastes need to be covered in Appendix I. It lists the characteristics and technical indicators of solder paste, and also covers test methods and metal content standards, as well as viscosity, slump, solder ball, viscosity and solder paste wettability.

9) IPC/EIAJ-STD-006A: Specification requirements for electronic grade solder alloys, fluxes and non-fluxed solid solders. For electronic grade solder alloys, for rod-shaped, strip-shaped, face-shaped flux and non-fluxed solders, for the application of electronic solder, it provides special terminology for special electronic grade solder name, specification requirements and test methods.

10) IPC-Ca-821: General requirements for thermally conductive adhesives. Covers the need for and testing methods for thermally conductive electrical media for bonding components to appropriate locations.

11) IPC-3406: Guidelines for Coating Adhesives for Conductive Surfaces. Provides guidance on the selection of conductive adhesives as solder alternatives in electronics fabrication.

12) IPC-AJ-820: Assembly and welding replacement book. It contains descriptions of inspection and inspection techniques for assembly and soldering, covering terminology and definitions; types of printed circuit boards, components and pins, solder joint materials, component installation, preset specification references and outlines ; welding technology and packaging; cleaning and lamination; quality assurance and testing.

13) IPC-7530: Temperature Profile Guidelines for Batch Soldering Processes (Reflow and Wave Soldering). Various test hands, techniques, and methods are used as deemed appropriate in temperature profile acquisition to provide guidance for establishing the best graphics.

14) IPC-TR-460A: Detailed registration form for wave soldering fault elimination of printed circuit boards. A detailed register of recommended corrective actions for faults that may be caused by wave soldering.

15) IPC/EIA/JEDECJ-STD-003A: Solderability test of printed circuit boards.

16) J-STD-013: Application of Ball Grid Array (SGA) and other high density technologies. Establish the specification requirements and interactions required for the printed circuit board packaging process, and provide information for the interconnection of high-performance and high-pin-count integrated circuit packaging, covering preset principle information, material selection, wrench production and assembly techniques, testing methods and reliable hope based on the background of the last use.

17) IPC-7095: Preset and assembly process replenishment of SGA parts. Provides a variety of useful operating information for many people who are using SGA components or thinking about turning to array packaging; provides guidance for SGA inspection, measurement and maintenance and provides reliable information about the SGA field.

18) IPC-M-I08: Cleaning Guide Manual. Covers the latest version of the IPC Cleaning Guide to assist in the cleaning process and troubleshooting of engineering final products.

19) IPC-CH-65-A: Cleaning Guidelines in Printed Wiring Board Assembly Title #e#19) IPC-CH-65-A: Cleaning Guidelines in Printed Wiring Board Assembly. Provides a reference for the cleaning methods used up to now and newly emerging in the electronics industry, covers the description and discussion of various cleaning methods, and explains the relationship between various materials, processes and contaminants in manufacturing and assembly operations .

20) IPC-SC-60A: Cleaning Manual for Solvents After Soldering. The use of solvent cleaning techniques in semi-automatic and manual welding is presented, and the nature of the solvent, carryover, and process constraints and background issues are discussed.

21) IPC-9201: Manual of Surface Insulation Resistance. It contains the terminology, theory, test process and test hand and eye of surface insulation resistance (SIR), as well as temperature, humidity (TH) test, fault standard pattern and fault elimination.

22) IPC-DRM-53: Introduction to Electronic Assembly Desktop Reference Manual. Illustrations and photos to explain through-hole and surface mount assembly techniques.

23) IPC-M-103: Surface Mount Assembly Manual Standard. The department reinsured all 21 IPC documents for the relevant surface mounts.

24) IPC-M-I04: Printed Wiring Board Assembly Manual Standard. It contains 10 of the most widely used documents related to PCB assembly.

25) IPC-CC-830B: Properties and Characterization of Electronic Insulating Compounds for Printed Wiring Board Assembly. Conformal coatings meet an industry standard for quality and qualification.

26) IPC-S-816: Surface Mounting Technology Process Guide and Detailed Registration Sheet. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and misplacement of components.

27) IPC-CM-770D: Installation Guide for Printed Circuit Board Components. Provides practical guidance for the preparation of components in printed circuit board assembly, and traces the relevant standards, influence and development status, covering assembly technology (covering manual and semi-automatic as well as surface mount technology and flip-chip technology). Assembly technology) and thinking about subsequent welding, cleaning and lamination processes.

28) IPC-7129: Calculation of the number of failures per million chance (DPMO) and printed circuit board assembly production indicators. Benchmark indicators that are identically agreed to by industry sectors related to the calculation of deficiencies and quality; it provides a good way to benchmark indicators of the number of failures per million opportunities.

29) IPC-9261: Printed Wiring Board Assembly Yield Estimates and Failures per Million Chances of Assembly Operations. Defines a reliable method for calculating the number of failures per million chance of a printed circuit board assembly implementation, and is a trade-off criterion for evaluation at various stages of the assembly process.

30) IPC-D-279: Predetermined Guidelines for Assembly of Printed Wiring Boards with Reliable Surface Mount Technology. A guide to the reliable production process of surface mount technology and mixed technology printed circuit boards, covering preset ideas.

31) IPC-2546: Combination requirements for handover essentials in printed circuit board assembly. Describes material movement systems such as actuators and buffers, manual placement, semi-automatic screen printing, semi-automatic adhesive dispensing, semi-automatic surface mount placement, semi-automatic plated through hole placement, forced convection, infrared reflow ovens, and wave firing weld.

32) IPC-PE-740A: Troubleshooting in the fabrication and assembly of printed circuit boards. Example documentation and proofreading activities covering cases where printed wiring products have revealed problems during presetting, fabrication, assembly and testing.

33) IPC-6010: A series of manuals on quality standards and performance specifications for printed circuit boards. Covers the quality standards and performance specifications established by the American Printed Circuit Board Association for all printed circuit boards.

34) IPC-6018A: Inspection and testing of microwave circuit boards. Covers the performance and qualification needs of high frequency (microwave) printed circuit boards.

35) IPC-D-317A: Predetermined Guidelines for Electronic Packaging Using High Speed Technology as Seen Appropriate. Provides guidance for the design of high-speed circuits, covering mechanical and electrical considerations and performance testing.